Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards
The effects of nanosize copper oxide and basic copper carbonate on the physical and mechanical properties of flakeboards were investigated according to ASTM Standard D-1037, and the curing process of phenol formaldehyde (PF) resin containing copper compounds was further investigated using dynamic di...
Guardado en:
| Autores principales: | , , |
|---|---|
| Lenguaje: | English |
| Publicado: |
Universidad del Bío-Bío
2011
|
| Materias: | |
| Acceso en línea: | http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2011000200008 |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|