Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene

In the present study, a methodology is appliedfor system reliability based design optimization (RBDO) to thin copper films that are deposited on flat surfaces of polypropylene polymer. The input data of the design of such polymer-metal joint was determined by the necessary normal stress to detach th...

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Autores principales: Corso,Leandro Luis, Gasparin,Alexandre Luis, Martins Gomes,Herbert
Lenguaje:English
Publicado: Universidad de Tarapacá. 2016
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Acceso en línea:http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-33052016000300015
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spelling oai:scielo:S0718-330520160003000152016-07-12Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropyleneCorso,Leandro LuisGasparin,Alexandre LuisMartins Gomes,Herbert Metallic thin films reliability optimization genetic algorithm In the present study, a methodology is appliedfor system reliability based design optimization (RBDO) to thin copper films that are deposited on flat surfaces of polypropylene polymer. The input data of the design of such polymer-metal joint was determined by the necessary normal stress to detach the copper film from the substrate of polypropylene by different forces and interface areas, obtained from uniaxial tensile test. The RBDO methodology was implemented in order to find the smallest bonding area required to assure different reliability levels, minimizing the detaching probability and cost (lower amount of the metallic film). The reliability level is treated as input data and considered as a constraint in the optimization problem. The used optimization methodology is the Genetic Algorithm (GA). This choice is due to the fact that GA presents good behavior when dealing with functions that may exhibit nonlinear behavior. The results shows that the applied methodology is efficient and it is concluded that high reliability requirements might impose larger areas. In the case of 98% of the reliability cases in not detaching the thin film, the resulted bonded area is 3.18 greater than the initial value without safety requirements.info:eu-repo/semantics/openAccessUniversidad de Tarapacá.Ingeniare. Revista chilena de ingeniería v.24 n.3 20162016-07-01text/htmlhttp://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-33052016000300015en10.4067/S0718-33052016000300015
institution Scielo Chile
collection Scielo Chile
language English
topic Metallic thin films
reliability
optimization
genetic algorithm
spellingShingle Metallic thin films
reliability
optimization
genetic algorithm
Corso,Leandro Luis
Gasparin,Alexandre Luis
Martins Gomes,Herbert
Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
description In the present study, a methodology is appliedfor system reliability based design optimization (RBDO) to thin copper films that are deposited on flat surfaces of polypropylene polymer. The input data of the design of such polymer-metal joint was determined by the necessary normal stress to detach the copper film from the substrate of polypropylene by different forces and interface areas, obtained from uniaxial tensile test. The RBDO methodology was implemented in order to find the smallest bonding area required to assure different reliability levels, minimizing the detaching probability and cost (lower amount of the metallic film). The reliability level is treated as input data and considered as a constraint in the optimization problem. The used optimization methodology is the Genetic Algorithm (GA). This choice is due to the fact that GA presents good behavior when dealing with functions that may exhibit nonlinear behavior. The results shows that the applied methodology is efficient and it is concluded that high reliability requirements might impose larger areas. In the case of 98% of the reliability cases in not detaching the thin film, the resulted bonded area is 3.18 greater than the initial value without safety requirements.
author Corso,Leandro Luis
Gasparin,Alexandre Luis
Martins Gomes,Herbert
author_facet Corso,Leandro Luis
Gasparin,Alexandre Luis
Martins Gomes,Herbert
author_sort Corso,Leandro Luis
title Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
title_short Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
title_full Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
title_fullStr Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
title_full_unstemmed Reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
title_sort reliability based design optimization using a genetic algorithm: application to bonded thin films areas of copper/polypropylene
publisher Universidad de Tarapacá.
publishDate 2016
url http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-33052016000300015
work_keys_str_mv AT corsoleandroluis reliabilitybaseddesignoptimizationusingageneticalgorithmapplicationtobondedthinfilmsareasofcopperpolypropylene
AT gasparinalexandreluis reliabilitybaseddesignoptimizationusingageneticalgorithmapplicationtobondedthinfilmsareasofcopperpolypropylene
AT martinsgomesherbert reliabilitybaseddesignoptimizationusingageneticalgorithmapplicationtobondedthinfilmsareasofcopperpolypropylene
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