Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

por Valentin Dubois, Shyamprasad N. Raja, Pascal Gehring, Sabina Caneva, Herre S. J. van der Zant, Frank Niklaus, Göran Stemme
Publicado 2018

Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

por Arne Quellmalz, Xiaojing Wang, Simon Sawallich, Burkay Uzlu, Martin Otto, Stefan Wagner, Zhenxing Wang, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Georg S. Duesberg, Max C. Lemme, Kristinn B. Gylfason, Niclas Roxhed, Göran Stemme, Frank Niklaus
Publicado 2021