Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects

por Hocheon Yoo, Hongkeun Park, Seunghyun Yoo, Sungmin On, Hyejeong Seong, Sung Gap Im, Jae-Joon Kim
Publicado 2019

Balancing Hole and Electron Conduction in Ambipolar Split-Gate Thin-Film Transistors

por Hocheon Yoo, Matteo Ghittorelli, Dong-Kyu Lee, Edsger C. P. Smits, Gerwin H. Gelinck, Hyungju Ahn, Han-Koo Lee, Fabrizio Torricelli, Jae-Joon Kim
Publicado 2017