Cita APA (7a ed.)

Shie, K., Hsu, P., Li, Y., Tu, K. N., & Chen, C. (2021). Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG.

Cita Chicago Style (17a ed.)

Shie, Kai-Cheng, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, y Chih Chen. Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG, 2021.

Cita MLA (8a ed.)

Shie, Kai-Cheng, et al. Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG, 2021.