Style de citation APA (7e éd.)

Shie, K., Hsu, P., Li, Y., Tu, K. N., & Chen, C. (2021). Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG.

Style de citation Chicago (17e éd.)

Shie, Kai-Cheng, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, et Chih Chen. Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG, 2021.

Style de citation MLA (8e éd.)

Shie, Kai-Cheng, et al. Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps. MDPI AG, 2021.