Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
In microelectronic packaging technology for three-dimensional integrated circuits (3D ICs), Cu-to-Cu direct bonding appears to be the solution to solve the problems of Joule heating and electromigration (EM) in solder microbumps under 10 <inline-formula><math xmlns="http://www.w3.org/1...
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| Autores principales: | , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/001536b276f041919c682d97487e8dc0 |
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