Impact of III-Nitride/Si Interface Preconditioning on Breakdown Voltage in GaN-on-Silicon HEMT
In this paper, an AIGaN/GaN metal-oxide-semiconductor high-electron-mobility transistor (MOS-HEMT) device is realized. The device shows normal ON characteristics with a maximum current of 570 mA/mm at a gate-to-source voltage of 3 V, an on-state resistance of 7.3 Ω·mm and breakdown voltage of 500 V....
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Main Authors: | , , , , |
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Format: | article |
Language: | EN |
Published: |
MDPI AG
2021
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Subjects: | |
Online Access: | https://doaj.org/article/0056dc521d4241e89fb0665b8e2bd0c2 |
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