Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO&...
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| Main Authors: | , , , , |
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| Format: | article |
| Language: | EN |
| Published: |
MDPI AG
2021
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| Subjects: | |
| Online Access: | https://doaj.org/article/011662bd94974b4aa5861b15c9567b39 |
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| Summary: | High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO<sub>2</sub> shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 <i>vol</i>%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m<sup>−1</sup>·K<sup>−1</sup>, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates. |
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