Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few mic...
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| Autores principales: | , , , |
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| Formato: | article |
| Lenguaje: | EN |
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MDPI AG
2021
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| Acceso en línea: | https://doaj.org/article/02afbf5cd7ac4268ba22781c1116e9fa |
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