Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu6Sn5 by Molecular Dynamic Simulation

Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu6Sn5 and Cu3Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few mic...

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Autores principales:	Wei Huang, Kailin Pan, Jian Zhang, Yubing Gong
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	strain rate temperature polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> molecular dynamic tensile properties Crystallography QD901-999
Acceso en línea:	https://doaj.org/article/02afbf5cd7ac4268ba22781c1116e9fa
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spelling	oai:doaj.org-article:02afbf5cd7ac4268ba22781c1116e9fa2021-11-25T17:19:35ZStrain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation10.3390/cryst111114152073-4352https://doaj.org/article/02afbf5cd7ac4268ba22781c1116e9fa2021-11-01T00:00:00Zhttps://www.mdpi.com/2073-4352/11/11/1415https://doaj.org/toc/2073-4352Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few microns thick, and it is difficult to study their mechanical properties by traditional methods. In this study, a 100 Å × 100 Å × 100 Å polycrystal with 10 grains was created by Atomsk through Voronoi tessellation based on a Cu<sub>6</sub>Sn<sub>5</sub> unit cell. The effects of the temperature and strain rate on the tensile properties of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> were analyzed based on MEAM potential function using a molecular dynamics (MD) method. The results show that Young’s modulus and ultimate tensile strength (UTS) of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> decrease approximately linearly with an increase in temperature. At high strain rates (0.001–100 ps<sup>−1</sup>), Young’s modulus and UTS of the Cu<sub>6</sub>Sn<sub>5</sub> are logarithmic with respect to the strain rate, and both increase with an increase in strain rate. In addition, at low strain rates (0.00001–0.0005 ps<sup>−1</sup>), the UTS has a quadratic increase as the strain rate increases.Wei HuangKailin PanJian ZhangYubing GongMDPI AGarticlestrain ratetemperaturepolycrystalline Cu<sub>6</sub>Sn<sub>5</sub>molecular dynamictensile propertiesCrystallographyQD901-999ENCrystals, Vol 11, Iss 1415, p 1415 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	strain rate temperature polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> molecular dynamic tensile properties Crystallography QD901-999
spellingShingle	strain rate temperature polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> molecular dynamic tensile properties Crystallography QD901-999 Wei Huang Kailin Pan Jian Zhang Yubing Gong Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
description	Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few microns thick, and it is difficult to study their mechanical properties by traditional methods. In this study, a 100 Å × 100 Å × 100 Å polycrystal with 10 grains was created by Atomsk through Voronoi tessellation based on a Cu<sub>6</sub>Sn<sub>5</sub> unit cell. The effects of the temperature and strain rate on the tensile properties of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> were analyzed based on MEAM potential function using a molecular dynamics (MD) method. The results show that Young’s modulus and ultimate tensile strength (UTS) of the polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> decrease approximately linearly with an increase in temperature. At high strain rates (0.001–100 ps<sup>−1</sup>), Young’s modulus and UTS of the Cu<sub>6</sub>Sn<sub>5</sub> are logarithmic with respect to the strain rate, and both increase with an increase in strain rate. In addition, at low strain rates (0.00001–0.0005 ps<sup>−1</sup>), the UTS has a quadratic increase as the strain rate increases.
format	article
author	Wei Huang Kailin Pan Jian Zhang Yubing Gong
author_facet	Wei Huang Kailin Pan Jian Zhang Yubing Gong
author_sort	Wei Huang
title	Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
title_short	Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
title_full	Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
title_fullStr	Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
title_full_unstemmed	Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation
title_sort	strain rate and temperature effects on tensile properties of polycrystalline cu<sub>6</sub>sn<sub>5</sub> by molecular dynamic simulation
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/02afbf5cd7ac4268ba22781c1116e9fa
work_keys_str_mv	AT weihuang strainrateandtemperatureeffectsontensilepropertiesofpolycrystallinecusub6subsnsub5subbymoleculardynamicsimulation AT kailinpan strainrateandtemperatureeffectsontensilepropertiesofpolycrystallinecusub6subsnsub5subbymoleculardynamicsimulation AT jianzhang strainrateandtemperatureeffectsontensilepropertiesofpolycrystallinecusub6subsnsub5subbymoleculardynamicsimulation AT yubinggong strainrateandtemperatureeffectsontensilepropertiesofpolycrystallinecusub6subsnsub5subbymoleculardynamicsimulation
_version_	1718412449104789504

Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu<sub>6</sub>Sn<sub>5</sub> by Molecular Dynamic Simulation

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