Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System

Abstract Contact property is now becoming to be a key factor for achieving high performance and high reliability in GaN-based III-V semiconductor devices. Energetic ion sputter, as an effective interface probe, is widely used to profile the metal/GaN contacts for interfacial analysis and process opt...

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Autores principales: Rong Huang, Fangsen Li, Tong Liu, Yanfei Zhao, Yafeng Zhu, Yang Shen, Xiaoming Lu, Zengli Huang, Jianping Liu, Liqun Zhang, Shuming Zhang, Zhanping Li, An Dingsun, Hui Yang
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Publicado: Nature Portfolio 2018
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Acceso en línea:https://doaj.org/article/02c5678d388b4ceabcb9031e76bd7986
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spelling oai:doaj.org-article:02c5678d388b4ceabcb9031e76bd79862021-12-02T15:07:59ZIon Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System10.1038/s41598-018-26734-52045-2322https://doaj.org/article/02c5678d388b4ceabcb9031e76bd79862018-06-01T00:00:00Zhttps://doi.org/10.1038/s41598-018-26734-5https://doaj.org/toc/2045-2322Abstract Contact property is now becoming to be a key factor for achieving high performance and high reliability in GaN-based III-V semiconductor devices. Energetic ion sputter, as an effective interface probe, is widely used to profile the metal/GaN contacts for interfacial analysis and process optimization. However, the details of ion-induced interfacial reaction, as well as the formation of sputter by-products at the interfaces are still unclear. Here by combining state-of-the-art Ar+ ion sputter with in-situ X-ray photoelectron spectroscopy (XPS) and ex-situ high resolution transmission electron microscopy (HRTEM), we have observed clearly not only the ion-induced chemical state changes at interface, but also the by-products at the prototypical Ti/GaN system. For the first time, we identified the formation of a metallic Ga layer at the GaOx/GaN interface. At the Ti/GaOx interface, TiCx components were also detected due to the reaction between metal Ti and surface-adsorbed C species. Our study reveals that the corresponding core level binding energy and peak intensity obtained from ion sputter depth profile should be treated with much caution, since they will be changed due to ion-induced interface reactions and formation of by-products during ion bombardment.Rong HuangFangsen LiTong LiuYanfei ZhaoYafeng ZhuYang ShenXiaoming LuZengli HuangJianping LiuLiqun ZhangShuming ZhangZhanping LiAn DingsunHui YangNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 8, Iss 1, Pp 1-7 (2018)
institution DOAJ
collection DOAJ
language EN
topic Medicine
R
Science
Q
spellingShingle Medicine
R
Science
Q
Rong Huang
Fangsen Li
Tong Liu
Yanfei Zhao
Yafeng Zhu
Yang Shen
Xiaoming Lu
Zengli Huang
Jianping Liu
Liqun Zhang
Shuming Zhang
Zhanping Li
An Dingsun
Hui Yang
Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
description Abstract Contact property is now becoming to be a key factor for achieving high performance and high reliability in GaN-based III-V semiconductor devices. Energetic ion sputter, as an effective interface probe, is widely used to profile the metal/GaN contacts for interfacial analysis and process optimization. However, the details of ion-induced interfacial reaction, as well as the formation of sputter by-products at the interfaces are still unclear. Here by combining state-of-the-art Ar+ ion sputter with in-situ X-ray photoelectron spectroscopy (XPS) and ex-situ high resolution transmission electron microscopy (HRTEM), we have observed clearly not only the ion-induced chemical state changes at interface, but also the by-products at the prototypical Ti/GaN system. For the first time, we identified the formation of a metallic Ga layer at the GaOx/GaN interface. At the Ti/GaOx interface, TiCx components were also detected due to the reaction between metal Ti and surface-adsorbed C species. Our study reveals that the corresponding core level binding energy and peak intensity obtained from ion sputter depth profile should be treated with much caution, since they will be changed due to ion-induced interface reactions and formation of by-products during ion bombardment.
format article
author Rong Huang
Fangsen Li
Tong Liu
Yanfei Zhao
Yafeng Zhu
Yang Shen
Xiaoming Lu
Zengli Huang
Jianping Liu
Liqun Zhang
Shuming Zhang
Zhanping Li
An Dingsun
Hui Yang
author_facet Rong Huang
Fangsen Li
Tong Liu
Yanfei Zhao
Yafeng Zhu
Yang Shen
Xiaoming Lu
Zengli Huang
Jianping Liu
Liqun Zhang
Shuming Zhang
Zhanping Li
An Dingsun
Hui Yang
author_sort Rong Huang
title Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
title_short Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
title_full Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
title_fullStr Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
title_full_unstemmed Ion Sputter Induced Interfacial Reaction in Prototypical Metal-GaN System
title_sort ion sputter induced interfacial reaction in prototypical metal-gan system
publisher Nature Portfolio
publishDate 2018
url https://doaj.org/article/02c5678d388b4ceabcb9031e76bd7986
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AT fangsenli ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT tongliu ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT yanfeizhao ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT yafengzhu ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT yangshen ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
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AT shumingzhang ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT zhanpingli ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT andingsun ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
AT huiyang ionsputterinducedinterfacialreactioninprototypicalmetalgansystem
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