Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Plasma-enhanced chemical vapour deposition (PECVD) is an industrially compatible microelectronics technology. Here, the authors use PECVD to obtain low-temperature, catalyst-free growth of poly-crystalline two-dimensional hexagonal-boron nitride, thus enabling superior thermal dissipation in WSe2 fi...

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Autores principales: Donghua Liu, Xiaosong Chen, Yaping Yan, Zhongwei Zhang, Zhepeng Jin, Kongyang Yi, Cong Zhang, Yujie Zheng, Yao Wang, Jun Yang, Xiangfan Xu, Jie Chen, Yunhao Lu, Dapeng Wei, Andrew Thye Shen Wee, Dacheng Wei
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2019
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Science
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Acceso en línea:https://doaj.org/article/03f0bb60becd4df091fcee1d73322325
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https://doaj.org/article/03f0bb60becd4df091fcee1d73322325

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