Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for insp...
Guardado en:
Autores principales: | , , , , , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
MDPI AG
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:doaj.org-article:0a4ed4f981044769bafd66ffef6a9a1d |
---|---|
record_format |
dspace |
spelling |
oai:doaj.org-article:0a4ed4f981044769bafd66ffef6a9a1d2021-11-11T15:24:07ZSequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors10.3390/app1121104192076-3417https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d2021-11-01T00:00:00Zhttps://www.mdpi.com/2076-3417/11/21/10419https://doaj.org/toc/2076-3417The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for inspecting whether sensors used in the semiconductor manufacturing process become stable or not. When the sensors are individually stable, the algorithm conducts the relational inspection to identify the relationship between two sensors. The key factor here is the coefficient of determination (R<sup>2</sup>). If R<sup>2</sup> is calculated as more than 0.7, their relationship is analyzed through the regression analysis, while the algorithm conducts the clustering analysis to the sensor pair with R<sup>2</sup> less than 0.7. This analysis also provided the capability to determine whether the newly generated data are defective or defect-free. Therefore, this study is not only applied to the semiconductor manufacturing process but can also be to the various research fields where the big data are treated.Hirak MazumdarTae Hyeon KimJong Min LeeEuiseok KumSeungho LeeSuho JeongBong Geun ChungMDPI AGarticledefect classificationmachine learningVoronoi diagramstatistical process controlTechnologyTEngineering (General). Civil engineering (General)TA1-2040Biology (General)QH301-705.5PhysicsQC1-999ChemistryQD1-999ENApplied Sciences, Vol 11, Iss 10419, p 10419 (2021) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
defect classification machine learning Voronoi diagram statistical process control Technology T Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999 |
spellingShingle |
defect classification machine learning Voronoi diagram statistical process control Technology T Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999 Hirak Mazumdar Tae Hyeon Kim Jong Min Lee Euiseok Kum Seungho Lee Suho Jeong Bong Geun Chung Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
description |
The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for inspecting whether sensors used in the semiconductor manufacturing process become stable or not. When the sensors are individually stable, the algorithm conducts the relational inspection to identify the relationship between two sensors. The key factor here is the coefficient of determination (R<sup>2</sup>). If R<sup>2</sup> is calculated as more than 0.7, their relationship is analyzed through the regression analysis, while the algorithm conducts the clustering analysis to the sensor pair with R<sup>2</sup> less than 0.7. This analysis also provided the capability to determine whether the newly generated data are defective or defect-free. Therefore, this study is not only applied to the semiconductor manufacturing process but can also be to the various research fields where the big data are treated. |
format |
article |
author |
Hirak Mazumdar Tae Hyeon Kim Jong Min Lee Euiseok Kum Seungho Lee Suho Jeong Bong Geun Chung |
author_facet |
Hirak Mazumdar Tae Hyeon Kim Jong Min Lee Euiseok Kum Seungho Lee Suho Jeong Bong Geun Chung |
author_sort |
Hirak Mazumdar |
title |
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
title_short |
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
title_full |
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
title_fullStr |
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
title_full_unstemmed |
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors |
title_sort |
sequential and comprehensive algorithm for fault detection in semiconductor sensors |
publisher |
MDPI AG |
publishDate |
2021 |
url |
https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d |
work_keys_str_mv |
AT hirakmazumdar sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT taehyeonkim sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT jongminlee sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT euiseokkum sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT seungholee sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT suhojeong sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors AT bonggeunchung sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors |
_version_ |
1718435349501313024 |