Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors

The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for insp...

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Autores principales: Hirak Mazumdar, Tae Hyeon Kim, Jong Min Lee, Euiseok Kum, Seungho Lee, Suho Jeong, Bong Geun Chung
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Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d
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spelling oai:doaj.org-article:0a4ed4f981044769bafd66ffef6a9a1d2021-11-11T15:24:07ZSequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors10.3390/app1121104192076-3417https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d2021-11-01T00:00:00Zhttps://www.mdpi.com/2076-3417/11/21/10419https://doaj.org/toc/2076-3417The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for inspecting whether sensors used in the semiconductor manufacturing process become stable or not. When the sensors are individually stable, the algorithm conducts the relational inspection to identify the relationship between two sensors. The key factor here is the coefficient of determination (R<sup>2</sup>). If R<sup>2</sup> is calculated as more than 0.7, their relationship is analyzed through the regression analysis, while the algorithm conducts the clustering analysis to the sensor pair with R<sup>2</sup> less than 0.7. This analysis also provided the capability to determine whether the newly generated data are defective or defect-free. Therefore, this study is not only applied to the semiconductor manufacturing process but can also be to the various research fields where the big data are treated.Hirak MazumdarTae Hyeon KimJong Min LeeEuiseok KumSeungho LeeSuho JeongBong Geun ChungMDPI AGarticledefect classificationmachine learningVoronoi diagramstatistical process controlTechnologyTEngineering (General). Civil engineering (General)TA1-2040Biology (General)QH301-705.5PhysicsQC1-999ChemistryQD1-999ENApplied Sciences, Vol 11, Iss 10419, p 10419 (2021)
institution DOAJ
collection DOAJ
language EN
topic defect classification
machine learning
Voronoi diagram
statistical process control
Technology
T
Engineering (General). Civil engineering (General)
TA1-2040
Biology (General)
QH301-705.5
Physics
QC1-999
Chemistry
QD1-999
spellingShingle defect classification
machine learning
Voronoi diagram
statistical process control
Technology
T
Engineering (General). Civil engineering (General)
TA1-2040
Biology (General)
QH301-705.5
Physics
QC1-999
Chemistry
QD1-999
Hirak Mazumdar
Tae Hyeon Kim
Jong Min Lee
Euiseok Kum
Seungho Lee
Suho Jeong
Bong Geun Chung
Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
description The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical process control (SPC) method is employed for inspecting whether sensors used in the semiconductor manufacturing process become stable or not. When the sensors are individually stable, the algorithm conducts the relational inspection to identify the relationship between two sensors. The key factor here is the coefficient of determination (R<sup>2</sup>). If R<sup>2</sup> is calculated as more than 0.7, their relationship is analyzed through the regression analysis, while the algorithm conducts the clustering analysis to the sensor pair with R<sup>2</sup> less than 0.7. This analysis also provided the capability to determine whether the newly generated data are defective or defect-free. Therefore, this study is not only applied to the semiconductor manufacturing process but can also be to the various research fields where the big data are treated.
format article
author Hirak Mazumdar
Tae Hyeon Kim
Jong Min Lee
Euiseok Kum
Seungho Lee
Suho Jeong
Bong Geun Chung
author_facet Hirak Mazumdar
Tae Hyeon Kim
Jong Min Lee
Euiseok Kum
Seungho Lee
Suho Jeong
Bong Geun Chung
author_sort Hirak Mazumdar
title Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
title_short Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
title_full Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
title_fullStr Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
title_full_unstemmed Sequential and Comprehensive Algorithm for Fault Detection in Semiconductor Sensors
title_sort sequential and comprehensive algorithm for fault detection in semiconductor sensors
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d
work_keys_str_mv AT hirakmazumdar sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT taehyeonkim sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT jongminlee sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT euiseokkum sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT seungholee sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT suhojeong sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
AT bonggeunchung sequentialandcomprehensivealgorithmforfaultdetectioninsemiconductorsensors
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