CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW

In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: FLORINA-CARMEN CIORNEI, STELIAN ALACI
Formato: article
Lenguaje:EN
Publicado: Alma Mater Publishing House "Vasile Alecsandri" University of Bacau 2015
Materias:
T
Acceso en línea:https://doaj.org/article/0b9f0c14b52f4718808945d96edd8e26
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!