CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW
In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal...
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Alma Mater Publishing House "Vasile Alecsandri" University of Bacau
2015
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oai:doaj.org-article:0b9f0c14b52f4718808945d96edd8e262021-12-02T19:49:54ZCHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW10.29081/jesr.v21i4.1282068-75592344-4932https://doaj.org/article/0b9f0c14b52f4718808945d96edd8e262015-12-01T00:00:00Zhttp://www.jesr.ub.ro/1/article/view/128https://doaj.org/toc/2068-7559https://doaj.org/toc/2344-4932 In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal conductivity. The properties of composite materials are theoretically modeled and for designing a semisolid the rheological characterization is required. The paper presents a concise review of the methods used in rheology for characterization of semisolids. FLORINA-CARMEN CIORNEISTELIAN ALACIAlma Mater Publishing House "Vasile Alecsandri" University of Bacauarticlethermal interface optimizationsemisolidrheologyTechnologyTEngineering (General). Civil engineering (General)TA1-2040ENJournal of Engineering Studies and Research, Vol 21, Iss 4 (2015) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
thermal interface optimization semisolid rheology Technology T Engineering (General). Civil engineering (General) TA1-2040 |
spellingShingle |
thermal interface optimization semisolid rheology Technology T Engineering (General). Civil engineering (General) TA1-2040 FLORINA-CARMEN CIORNEI STELIAN ALACI CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
description |
In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal conductivity. The properties of composite materials are theoretically modeled and for designing a semisolid the rheological characterization is required. The paper presents a concise review of the methods used in rheology for characterization of semisolids.
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format |
article |
author |
FLORINA-CARMEN CIORNEI STELIAN ALACI |
author_facet |
FLORINA-CARMEN CIORNEI STELIAN ALACI |
author_sort |
FLORINA-CARMEN CIORNEI |
title |
CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
title_short |
CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
title_full |
CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
title_fullStr |
CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
title_full_unstemmed |
CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW |
title_sort |
characterization of rheological properties of semisolid materials used as thermal interfaces. part i: a brief review |
publisher |
Alma Mater Publishing House "Vasile Alecsandri" University of Bacau |
publishDate |
2015 |
url |
https://doaj.org/article/0b9f0c14b52f4718808945d96edd8e26 |
work_keys_str_mv |
AT florinacarmenciornei characterizationofrheologicalpropertiesofsemisolidmaterialsusedasthermalinterfacespartiabriefreview AT stelianalaci characterizationofrheologicalpropertiesofsemisolidmaterialsusedasthermalinterfacespartiabriefreview |
_version_ |
1718375943469268992 |