Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions
The continued scaling of silicon based electronic devices requires the development of increasingly innovative approaches for high-precision material removal. Here, the authors demonstrate subnanometre depth removal of silicon using scanning probe, shear-induced mechanochemical reactions.
Enregistré dans:
Auteurs principaux: | , , , , , , , , |
---|---|
Format: | article |
Langue: | EN |
Publié: |
Nature Portfolio
2018
|
Sujets: | |
Accès en ligne: | https://doaj.org/article/1071abe741d246fea39f12ba76a2af02 |
Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|