An effective approach for identifying defective critical fabrication path
Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatu...
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| Format: | article |
| Language: | EN |
| Published: |
Taylor & Francis Group
2019
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| Subjects: | |
| Online Access: | https://doaj.org/article/176e00c33b154b96a003414024dba34e |
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