An effective approach for identifying defective critical fabrication path

Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatu...

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Autor principal:	Kamal Taha
Formato:	article
Lenguaje:	EN
Publicado:	Taylor & Francis Group 2019
Materias:	wafer defect faulty tool wafer fabrication semiconductor processing step Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/176e00c33b154b96a003414024dba34e
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id	oai:doaj.org-article:176e00c33b154b96a003414024dba34e
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spelling	oai:doaj.org-article:176e00c33b154b96a003414024dba34e2021-11-04T15:51:55ZAn effective approach for identifying defective critical fabrication path2331-191610.1080/23311916.2019.1575636https://doaj.org/article/176e00c33b154b96a003414024dba34e2019-01-01T00:00:00Zhttp://dx.doi.org/10.1080/23311916.2019.1575636https://doaj.org/toc/2331-1916Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatures discovered at the end of the fabrication procedure are, most often, processed through same faulty tools. The fabrication paths of most defective wafers converge at some point to form a common sub-path before they disperse again. Usually, faulty tools in this common path cause most of the different defect signatures discovered at the end of the fabrication procedure. Process engineers would need to trace in reverse the fabrication paths to identify this common path to repair its tools. We introduce in this paper a defect diagnostic system called IDFP that can identify the common fabrication path that caused most of the defectivities on wafers discovered at the end of the fabrication procedure. We evaluated the quality of IDFP by experimentally comparing it with two systems. Results revealed marked improvement.Kamal TahaTaylor & Francis Grouparticlewafer defectfaulty toolwafer fabricationsemiconductor processing stepEngineering (General). Civil engineering (General)TA1-2040ENCogent Engineering, Vol 6, Iss 1 (2019)
institution	DOAJ
collection	DOAJ
language	EN
topic	wafer defect faulty tool wafer fabrication semiconductor processing step Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	wafer defect faulty tool wafer fabrication semiconductor processing step Engineering (General). Civil engineering (General) TA1-2040 Kamal Taha An effective approach for identifying defective critical fabrication path
description	Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatures discovered at the end of the fabrication procedure are, most often, processed through same faulty tools. The fabrication paths of most defective wafers converge at some point to form a common sub-path before they disperse again. Usually, faulty tools in this common path cause most of the different defect signatures discovered at the end of the fabrication procedure. Process engineers would need to trace in reverse the fabrication paths to identify this common path to repair its tools. We introduce in this paper a defect diagnostic system called IDFP that can identify the common fabrication path that caused most of the defectivities on wafers discovered at the end of the fabrication procedure. We evaluated the quality of IDFP by experimentally comparing it with two systems. Results revealed marked improvement.
format	article
author	Kamal Taha
author_facet	Kamal Taha
author_sort	Kamal Taha
title	An effective approach for identifying defective critical fabrication path
title_short	An effective approach for identifying defective critical fabrication path
title_full	An effective approach for identifying defective critical fabrication path
title_fullStr	An effective approach for identifying defective critical fabrication path
title_full_unstemmed	An effective approach for identifying defective critical fabrication path
title_sort	effective approach for identifying defective critical fabrication path
publisher	Taylor & Francis Group
publishDate	2019
url	https://doaj.org/article/176e00c33b154b96a003414024dba34e
work_keys_str_mv	AT kamaltaha aneffectiveapproachforidentifyingdefectivecriticalfabricationpath AT kamaltaha effectiveapproachforidentifyingdefectivecriticalfabricationpath
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An effective approach for identifying defective critical fabrication path

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