Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu

Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly <111>-oriented nanotwinn...

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Auteurs principaux: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen
Format: article
Langue:EN
Publié: MDPI AG 2021
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Accès en ligne:https://doaj.org/article/1e393c7a30df46e085ef972288f6a5d5
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