Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu

Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly <111>-oriented nanotwinn...

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Autores principales:	Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	highly <111>-oriented nanotwinned copper die-to-die bonding die-to-wafer bonding post-annealing grain growth die shear test Mining engineering. Metallurgy TN1-997
Acceso en línea:	https://doaj.org/article/1e393c7a30df46e085ef972288f6a5d5
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spelling	oai:doaj.org-article:1e393c7a30df46e085ef972288f6a5d52021-11-25T18:22:31ZShearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu10.3390/met111118642075-4701https://doaj.org/article/1e393c7a30df46e085ef972288f6a5d52021-11-01T00:00:00Zhttps://www.mdpi.com/2075-4701/11/11/1864https://doaj.org/toc/2075-4701Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly <111>-oriented nanotwinned Cu (nt-Cu). Alignment and bonding were achieved at 10 s in the first step, and a post-annealing process was further conducted to enhance its bonding strength. Results show that bonding strength was enhanced by 2–3 times after a post-annealing step. We found 50% of ductile fractures among 4548 post-annealed microbumps in one chip, while the rate was less than 20% for the as-bonded counterparts. During the post-annealing, interfacial grain growth and recrystallization occurred, and the bonding interface was eliminated. Ductile fracture in the form of zig-zag grain boundary was found at the original bonding interface, thus resulting in an increase in bonding strength of the microbumps.Jia-Juen OngDinh-Phuc TranShih-Chi YangKai-Cheng ShieChih ChenMDPI AGarticlehighly <111>-oriented nanotwinned copperdie-to-die bondingdie-to-wafer bondingpost-annealinggrain growthdie shear testMining engineering. MetallurgyTN1-997ENMetals, Vol 11, Iss 1864, p 1864 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	highly <111>-oriented nanotwinned copper die-to-die bonding die-to-wafer bonding post-annealing grain growth die shear test Mining engineering. Metallurgy TN1-997
spellingShingle	highly <111>-oriented nanotwinned copper die-to-die bonding die-to-wafer bonding post-annealing grain growth die shear test Mining engineering. Metallurgy TN1-997 Jia-Juen Ong Dinh-Phuc Tran Shih-Chi Yang Kai-Cheng Shie Chih Chen Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
description	Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly <111>-oriented nanotwinned Cu (nt-Cu). Alignment and bonding were achieved at 10 s in the first step, and a post-annealing process was further conducted to enhance its bonding strength. Results show that bonding strength was enhanced by 2–3 times after a post-annealing step. We found 50% of ductile fractures among 4548 post-annealed microbumps in one chip, while the rate was less than 20% for the as-bonded counterparts. During the post-annealing, interfacial grain growth and recrystallization occurred, and the bonding interface was eliminated. Ductile fracture in the form of zig-zag grain boundary was found at the original bonding interface, thus resulting in an increase in bonding strength of the microbumps.
format	article
author	Jia-Juen Ong Dinh-Phuc Tran Shih-Chi Yang Kai-Cheng Shie Chih Chen
author_facet	Jia-Juen Ong Dinh-Phuc Tran Shih-Chi Yang Kai-Cheng Shie Chih Chen
author_sort	Jia-Juen Ong
title	Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
title_short	Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
title_full	Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
title_fullStr	Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
title_full_unstemmed	Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
title_sort	shearing characteristics of cu-cu joints fabricated by two-step process using highly <111>-oriented nanotwinned cu
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/1e393c7a30df46e085ef972288f6a5d5
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Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu

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