Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point...

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Autores principales: Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Matej Pasak
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d3
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