Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point...

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Autores principales:	Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Matej Pasak
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	ultrasonic intermetallic compounds solder composite Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
Acceso en línea:	https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d3
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spelling	oai:doaj.org-article:1f7d3c91f30b4a7aa49fb5d101aca6d32021-11-11T17:56:22ZCharacterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite10.3390/ma142163691996-1944https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d32021-10-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/21/6369https://doaj.org/toc/1996-1944The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti<sub>6</sub>(Sb,Sn)<sub>5</sub> phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)<sub>6</sub>(Sb,Sn)<sub>5</sub> reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu<sub>6</sub>Sn<sub>5</sub> phase, formed in contact with the solder, and the non-wettable ε-Cu<sub>3</sub>Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.Roman KolenakIgor KostolnyJaromir DrapalaPaulina BabincovaMatej PasakMDPI AGarticleultrasonicintermetallic compoundssoldercompositeTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6369, p 6369 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	ultrasonic intermetallic compounds solder composite Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
spellingShingle	ultrasonic intermetallic compounds solder composite Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Roman Kolenak Igor Kostolny Jaromir Drapala Paulina Babincova Matej Pasak Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
description	The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti<sub>6</sub>(Sb,Sn)<sub>5</sub> phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)<sub>6</sub>(Sb,Sn)<sub>5</sub> reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu<sub>6</sub>Sn<sub>5</sub> phase, formed in contact with the solder, and the non-wettable ε-Cu<sub>3</sub>Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.
format	article
author	Roman Kolenak Igor Kostolny Jaromir Drapala Paulina Babincova Matej Pasak
author_facet	Roman Kolenak Igor Kostolny Jaromir Drapala Paulina Babincova Matej Pasak
author_sort	Roman Kolenak
title	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
title_short	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
title_full	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
title_fullStr	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
title_full_unstemmed	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite
title_sort	characterization of sn–sb–ti solder alloy and the study of its use for the ultrasonic soldering process of sic ceramics with a cu–sic metal–ceramic composite
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d3
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Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

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