Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point...

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Bibliographic Details
Main Authors: Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Matej Pasak
Format: article
Language:EN
Published: MDPI AG 2021
Subjects:
ultrasonic
intermetallic compounds
solder
composite
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Online Access:https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d3
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https://doaj.org/article/1f7d3c91f30b4a7aa49fb5d101aca6d3

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