Bonding of a Carbon Nanotube Film to a Au Film at Low Temperature and Contact Resistance of the Film under Micronewton Loads
A process for bonding a carbon nanotube (CNT) film to a Au film at low temperature was developed with a view to using the CNT films as electrical contact materials in radio-frequency microelectromechanical systems (RF MEMS) switches. First, a CNT film was synthesized on a silicon substrate at 750 &a...
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| Auteurs principaux: | , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
Japanese Society of Tribologists
2011
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/249d89cd2f984ddba2c897317d5c37cc |
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