Bonding of a Carbon Nanotube Film to a Au Film at Low Temperature and Contact Resistance of the Film under Micronewton Loads

A process for bonding a carbon nanotube (CNT) film to a Au film at low temperature was developed with a view to using the CNT films as electrical contact materials in radio-frequency microelectromechanical systems (RF MEMS) switches. First, a CNT film was synthesized on a silicon substrate at 750 &a...

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Autores principales: Hiroshi Kinoshita, Yoshitada Isono, Nobuo Ohmae
Formato: article
Lenguaje:EN
Publicado: Japanese Society of Tribologists 2011
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Acceso en línea:https://doaj.org/article/249d89cd2f984ddba2c897317d5c37cc
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