Bonding of a Carbon Nanotube Film to a Au Film at Low Temperature and Contact Resistance of the Film under Micronewton Loads
A process for bonding a carbon nanotube (CNT) film to a Au film at low temperature was developed with a view to using the CNT films as electrical contact materials in radio-frequency microelectromechanical systems (RF MEMS) switches. First, a CNT film was synthesized on a silicon substrate at 750 &a...
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Japanese Society of Tribologists
2011
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/249d89cd2f984ddba2c897317d5c37cc |
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