Adhesion analysis of silane coupling agent/copper interface with density functional theory
Nanotechnology devices with strong adhesion strength are required due to the miniaturization and reduction of the thickness of electronic devices. This paper describes a technique to select a silane coupling agent effective for obtaining the strong adhesion with copper by use of a density functional...
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| Auteurs principaux: | , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
The Japan Society of Mechanical Engineers
2014
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/2b0f50bd98fc4ab2bad06e8cab4c2cd7 |
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