Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.

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Autores principales: B. Chad Hornbuckle, Cyril L. Williams, Steven W. Dean, Xuyang Zhou, Chaitanya Kale, Scott A. Turnage, John D. Clayton, Gregory B. Thompson, Anit K. Giri, Kiran N. Solanki, Kristopher A. Darling
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2020
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Acceso en línea:https://doaj.org/article/347a072ca05c4e96a573797ee68f5ad0
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