Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.

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Autores principales:	B. Chad Hornbuckle, Cyril L. Williams, Steven W. Dean, Xuyang Zhou, Chaitanya Kale, Scott A. Turnage, John D. Clayton, Gregory B. Thompson, Anit K. Giri, Kiran N. Solanki, Kristopher A. Darling
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2020
Materias:	Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/347a072ca05c4e96a573797ee68f5ad0
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id	oai:doaj.org-article:347a072ca05c4e96a573797ee68f5ad0
record_format	dspace
spelling	oai:doaj.org-article:347a072ca05c4e96a573797ee68f5ad02021-12-02T16:51:49ZStable microstructure in a nanocrystalline copper–tantalum alloy during shock loading10.1038/s43246-020-0024-32662-4443https://doaj.org/article/347a072ca05c4e96a573797ee68f5ad02020-05-01T00:00:00Zhttps://doi.org/10.1038/s43246-020-0024-3https://doaj.org/toc/2662-4443Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.B. Chad HornbuckleCyril L. WilliamsSteven W. DeanXuyang ZhouChaitanya KaleScott A. TurnageJohn D. ClaytonGregory B. ThompsonAnit K. GiriKiran N. SolankiKristopher A. DarlingNature PortfolioarticleMaterials of engineering and construction. Mechanics of materialsTA401-492ENCommunications Materials, Vol 1, Iss 1, Pp 1-6 (2020)
institution	DOAJ
collection	DOAJ
language	EN
topic	Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Materials of engineering and construction. Mechanics of materials TA401-492 B. Chad Hornbuckle Cyril L. Williams Steven W. Dean Xuyang Zhou Chaitanya Kale Scott A. Turnage John D. Clayton Gregory B. Thompson Anit K. Giri Kiran N. Solanki Kristopher A. Darling Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
description	Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.
format	article
author	B. Chad Hornbuckle Cyril L. Williams Steven W. Dean Xuyang Zhou Chaitanya Kale Scott A. Turnage John D. Clayton Gregory B. Thompson Anit K. Giri Kiran N. Solanki Kristopher A. Darling
author_facet	B. Chad Hornbuckle Cyril L. Williams Steven W. Dean Xuyang Zhou Chaitanya Kale Scott A. Turnage John D. Clayton Gregory B. Thompson Anit K. Giri Kiran N. Solanki Kristopher A. Darling
author_sort	B. Chad Hornbuckle
title	Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
title_short	Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
title_full	Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
title_fullStr	Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
title_full_unstemmed	Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
title_sort	stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
publisher	Nature Portfolio
publishDate	2020
url	https://doaj.org/article/347a072ca05c4e96a573797ee68f5ad0
work_keys_str_mv	AT bchadhornbuckle stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT cyrillwilliams stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT stevenwdean stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT xuyangzhou stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT chaitanyakale stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT scottaturnage stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT johndclayton stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT gregorybthompson stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT anitkgiri stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT kirannsolanki stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading AT kristopheradarling stablemicrostructureinananocrystallinecoppertantalumalloyduringshockloading
_version_	1718382909297000448

Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

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