Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.
Guardado en:
Autores principales: | B. Chad Hornbuckle, Cyril L. Williams, Steven W. Dean, Xuyang Zhou, Chaitanya Kale, Scott A. Turnage, John D. Clayton, Gregory B. Thompson, Anit K. Giri, Kiran N. Solanki, Kristopher A. Darling |
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Formato: | article |
Lenguaje: | EN |
Publicado: |
Nature Portfolio
2020
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Materias: | |
Acceso en línea: | https://doaj.org/article/347a072ca05c4e96a573797ee68f5ad0 |
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