Nanoscale evolution of interface morphology during electrodeposition

Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.

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Auteurs principaux: Nicholas M. Schneider, Jeung Hun Park, Joseph M. Grogan, Daniel A. Steingart, Haim H. Bau, Frances M. Ross
Format: article
Langue:EN
Publié: Nature Portfolio 2017
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Accès en ligne:https://doaj.org/article/37436eebbfbd43b690c018dc7fabe6e4
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