Nanoscale evolution of interface morphology during electrodeposition

Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.

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Autores principales: Nicholas M. Schneider, Jeung Hun Park, Joseph M. Grogan, Daniel A. Steingart, Haim H. Bau, Frances M. Ross
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2017
Materias:
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Acceso en línea:https://doaj.org/article/37436eebbfbd43b690c018dc7fabe6e4
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