Nanoscale evolution of interface morphology during electrodeposition

Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.

Saved in:
Bibliographic Details
Main Authors: Nicholas M. Schneider, Jeung Hun Park, Joseph M. Grogan, Daniel A. Steingart, Haim H. Bau, Frances M. Ross
Format: article
Language:EN
Published: Nature Portfolio 2017
Subjects:
Q
Online Access:https://doaj.org/article/37436eebbfbd43b690c018dc7fabe6e4
Tags: Add Tag
No Tags, Be the first to tag this record!