Effects of temperature conditions on fracture toughness of single crystal silicon wafer
This paper provides effects of furnace temperature conditions on the fracture toughness value of cleavage plane {110} on a single crystal silicon wafer. The fracture toughness KIC was measured using the controlled surface flaw (CSF) method under an assumption to develop a thin crack introduced by a...
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| Autores principales: | , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
The Japan Society of Mechanical Engineers
2019
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/3a8dbfd35df649228ebfa1e73d67c99d |
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