Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers
Precision machining (e.g., fine grinding, polishing) induced residual stress is very small and often not constant across the wafer and it is difficult to be directly obtained by stress testing equipment or Stoney equation. The residual stress could be obtained theoretically based on the principle of...
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| Autores principales: | , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/3b494ba16b144f569d58bf5c5ec6dde0 |
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