APA (7th ed.) Citation

Liu, H., Yang, T., Han, J., Tian, X., Chen, S., & Lu, L. (2021). Obtainment of Residual Stress Distribution from Surface Deformation under Continuity Constraints for Thinned Silicon Wafers. MDPI AG.

Chicago Style (17th ed.) Citation

Liu, Haijun, Tao Yang, Jiang Han, Xiaoqing Tian, Shan Chen, and Lei Lu. Obtainment of Residual Stress Distribution from Surface Deformation Under Continuity Constraints for Thinned Silicon Wafers. MDPI AG, 2021.

MLA (8th ed.) Citation

Liu, Haijun, et al. Obtainment of Residual Stress Distribution from Surface Deformation Under Continuity Constraints for Thinned Silicon Wafers. MDPI AG, 2021.