Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

Control over the crystallographic orientation of solder joints based on βSn will improve the reliability of electronic interconnects. Using a technique based on droplet solidification and lattice matching, Ma et al. are able to control the βSn nucleation events, hence control the grain orientation....

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Autores principales: Z. L. Ma, S. A. Belyakov, K. Sweatman, T. Nishimura, C. M. Gourlay
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2017
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Acceso en línea:https://doaj.org/article/5e48c41bcd6141a2a7244abd55d73068
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