Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
Control over the crystallographic orientation of solder joints based on βSn will improve the reliability of electronic interconnects. Using a technique based on droplet solidification and lattice matching, Ma et al. are able to control the βSn nucleation events, hence control the grain orientation....
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| Autores principales: | , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2017
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/5e48c41bcd6141a2a7244abd55d73068 |
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