Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency

High-precision optical component manufacturing by ion beam machining tools with ultra-high material removal resolution and dynamically adjustable removal efficiency is important in various industries. In this paper, we propose a low-energy pulsed ion beam (LPIB) technology that can obtain a single p...

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Autores principales:	Guangqi Zhou, Ye Tian, Feng Shi, Ci Song, Guipeng Tie, Gang Zhou, Lingbo Xie, Jianda Shao, Zhouling Wu
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	low-energy pulsed ion beam pulse frequency pulse duty cycle ultra-high removal resolution Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/5eeaada728f44373a5a1443293feeaa8
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spelling	oai:doaj.org-article:5eeaada728f44373a5a1443293feeaa82021-11-25T18:23:28ZLow-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency10.3390/mi121113702072-666Xhttps://doaj.org/article/5eeaada728f44373a5a1443293feeaa82021-11-01T00:00:00Zhttps://www.mdpi.com/2072-666X/12/11/1370https://doaj.org/toc/2072-666XHigh-precision optical component manufacturing by ion beam machining tools with ultra-high material removal resolution and dynamically adjustable removal efficiency is important in various industries. In this paper, we propose a low-energy pulsed ion beam (LPIB) technology that can obtain a single pulse with high-resolution material removal by adjusting the pulse frequency and duty cycle, and enable the dynamic adjustment of the removal efficiency. The pulse frequency is 1–100 Hz, and the duty cycle is 0–100%. For monocrystalline silicon, the pulse frequency and duty cycle are set to 100 Hz and 1%, respectively; thus, the single-shot pulse depth removal resolution of material is 6.7 × 10<sup>−4</sup> nm, which means every 21 pulses can remove one silicon atom layer. Compared with IBF, where the removal resolution of the maximum depth is about 0.01 nm, the controllable resolution is one to two orders of magnitude higher. There is a linear relationship between the removal efficiency of the pulsed ion beam removal function and the pulse duty ratio. The material removal of a single pulse can be adjusted in real time by adjusting the pulse duty cycle and frequency. Owing to its high resolution and wide adjustable removal efficiency, LPIB has broad application prospects in the field of sub-nano-precision surface modification, quality tuning of inertial resonant devices, and so on. This technology is expected to advance surface processing and ultra-precision manufacturing.Guangqi ZhouYe TianFeng ShiCi SongGuipeng TieGang ZhouLingbo XieJianda ShaoZhouling WuMDPI AGarticlelow-energy pulsed ion beampulse frequencypulse duty cycleultra-high removal resolutionMechanical engineering and machineryTJ1-1570ENMicromachines, Vol 12, Iss 1370, p 1370 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	low-energy pulsed ion beam pulse frequency pulse duty cycle ultra-high removal resolution Mechanical engineering and machinery TJ1-1570
spellingShingle	low-energy pulsed ion beam pulse frequency pulse duty cycle ultra-high removal resolution Mechanical engineering and machinery TJ1-1570 Guangqi Zhou Ye Tian Feng Shi Ci Song Guipeng Tie Gang Zhou Lingbo Xie Jianda Shao Zhouling Wu Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
description	High-precision optical component manufacturing by ion beam machining tools with ultra-high material removal resolution and dynamically adjustable removal efficiency is important in various industries. In this paper, we propose a low-energy pulsed ion beam (LPIB) technology that can obtain a single pulse with high-resolution material removal by adjusting the pulse frequency and duty cycle, and enable the dynamic adjustment of the removal efficiency. The pulse frequency is 1–100 Hz, and the duty cycle is 0–100%. For monocrystalline silicon, the pulse frequency and duty cycle are set to 100 Hz and 1%, respectively; thus, the single-shot pulse depth removal resolution of material is 6.7 × 10<sup>−4</sup> nm, which means every 21 pulses can remove one silicon atom layer. Compared with IBF, where the removal resolution of the maximum depth is about 0.01 nm, the controllable resolution is one to two orders of magnitude higher. There is a linear relationship between the removal efficiency of the pulsed ion beam removal function and the pulse duty ratio. The material removal of a single pulse can be adjusted in real time by adjusting the pulse duty cycle and frequency. Owing to its high resolution and wide adjustable removal efficiency, LPIB has broad application prospects in the field of sub-nano-precision surface modification, quality tuning of inertial resonant devices, and so on. This technology is expected to advance surface processing and ultra-precision manufacturing.
format	article
author	Guangqi Zhou Ye Tian Feng Shi Ci Song Guipeng Tie Gang Zhou Lingbo Xie Jianda Shao Zhouling Wu
author_facet	Guangqi Zhou Ye Tian Feng Shi Ci Song Guipeng Tie Gang Zhou Lingbo Xie Jianda Shao Zhouling Wu
author_sort	Guangqi Zhou
title	Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
title_short	Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
title_full	Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
title_fullStr	Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
title_full_unstemmed	Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency
title_sort	low-energy pulsed ion beam technology with ultra-high material removal resolution and widely adjustable removal efficiency
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/5eeaada728f44373a5a1443293feeaa8
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_version_	1718411197907206144

Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency

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