The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Abstract We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturing as they enable 3D chip integratio...

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Autores principales:	Simone Frasca, Rebecca C. Leghziel, Ivo N. Arabadzhiev, Benoît Pasquier, Grégoire F. M. Tomassi, Sandro Carrara, Edoardo Charbon
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/63513650693f4fa984e3e79944393796
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spelling	oai:doaj.org-article:63513650693f4fa984e3e799443937962021-12-02T12:11:34ZThe Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias10.1038/s41598-021-83546-w2045-2322https://doaj.org/article/63513650693f4fa984e3e799443937962021-02-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-83546-whttps://doaj.org/toc/2045-2322Abstract We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturing as they enable 3D chip integration. However, the usual standardized TSV fabrication process has to deal with scalloping, an imperfection in the sidewalls caused by the deep reactive ion etching. The presence of scalloping causes stress and field concentration in the dielectric barrier, thereby dramatically impacting the following TSV filling step, which is performed by means of electrochemical plating. So, we propose here a new scallop free and non-tapered approach to overcome this challenge by adding a new step to the standard TSV procedure exploiting the crystalline orientation of silicon wafers. Thank to this new step, that we called “Michelangelo”, we obtained an extremely well polishing of the TSV holes, by reaching atomic-level smoothness and a record aspect ratio of 28:1. The Michelangelo step will thus drastically reduce the footprint of 3D structures and will allow unprecedented efficiency in 3D chip integration.Simone FrascaRebecca C. LeghzielIvo N. ArabadzhievBenoît PasquierGrégoire F. M. TomassiSandro CarraraEdoardo CharbonNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-6 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Simone Frasca Rebecca C. Leghziel Ivo N. Arabadzhiev Benoît Pasquier Grégoire F. M. Tomassi Sandro Carrara Edoardo Charbon The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
description	Abstract We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturing as they enable 3D chip integration. However, the usual standardized TSV fabrication process has to deal with scalloping, an imperfection in the sidewalls caused by the deep reactive ion etching. The presence of scalloping causes stress and field concentration in the dielectric barrier, thereby dramatically impacting the following TSV filling step, which is performed by means of electrochemical plating. So, we propose here a new scallop free and non-tapered approach to overcome this challenge by adding a new step to the standard TSV procedure exploiting the crystalline orientation of silicon wafers. Thank to this new step, that we called “Michelangelo”, we obtained an extremely well polishing of the TSV holes, by reaching atomic-level smoothness and a record aspect ratio of 28:1. The Michelangelo step will thus drastically reduce the footprint of 3D structures and will allow unprecedented efficiency in 3D chip integration.
format	article
author	Simone Frasca Rebecca C. Leghziel Ivo N. Arabadzhiev Benoît Pasquier Grégoire F. M. Tomassi Sandro Carrara Edoardo Charbon
author_facet	Simone Frasca Rebecca C. Leghziel Ivo N. Arabadzhiev Benoît Pasquier Grégoire F. M. Tomassi Sandro Carrara Edoardo Charbon
author_sort	Simone Frasca
title	The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
title_short	The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
title_full	The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
title_fullStr	The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
title_full_unstemmed	The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
title_sort	michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/63513650693f4fa984e3e79944393796
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The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

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