Kalaš, D., Šíma, K., Kadlec, P., Polanský, R., Soukup, R., Řeboun, J., & Hamáček, A. (2021). FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. MDPI AG.
Cita Chicago Style (17a ed.)Kalaš, David, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup, Jan Řeboun, y Aleš Hamáček. FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. MDPI AG, 2021.
Cita MLA (8a ed.)Kalaš, David, et al. FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. MDPI AG, 2021.
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