FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers

The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based...

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Autores principales: David Kalaš, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup, Jan Řeboun, Aleš Hamáček
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/63fd3960f72f48158f3ecd1e43740196
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