Seeking advanced thermal management for stretchable electronics

Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For pa...

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Autores principales: Bin Sun, Xingyi Huang
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2021
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Acceso en línea:https://doaj.org/article/64c7505c9d9243fc8da048c24c312a3e
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