Seeking advanced thermal management for stretchable electronics

Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For pa...

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Autores principales:	Bin Sun, Xingyi Huang
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/64c7505c9d9243fc8da048c24c312a3e
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id	oai:doaj.org-article:64c7505c9d9243fc8da048c24c312a3e
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spelling	oai:doaj.org-article:64c7505c9d9243fc8da048c24c312a3e2021-12-02T17:47:34ZSeeking advanced thermal management for stretchable electronics10.1038/s41528-021-00109-92397-4621https://doaj.org/article/64c7505c9d9243fc8da048c24c312a3e2021-06-01T00:00:00Zhttps://doi.org/10.1038/s41528-021-00109-9https://doaj.org/toc/2397-4621Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For passive thermal management, the traditional thermal interfacial materials (TIMs) with flexibility cannot meet the demand of stretchable electronics, because stretchable devices are usually required to experience a large scale of bending, twisting, stretching, and so on. The main challenge facing thermal management for stretchable electronics is how to maintain stable thermal conductance under large deformation. Here, we examine the development of materials and structures available in this field. We also propose a comparative analysis of the existing challenges and provide possible solutions for the thermal management of stretchable electronics in the future.Bin SunXingyi HuangNature PortfolioarticleElectronicsTK7800-8360Materials of engineering and construction. Mechanics of materialsTA401-492ENnpj Flexible Electronics, Vol 5, Iss 1, Pp 1-5 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492 Bin Sun Xingyi Huang Seeking advanced thermal management for stretchable electronics
description	Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For passive thermal management, the traditional thermal interfacial materials (TIMs) with flexibility cannot meet the demand of stretchable electronics, because stretchable devices are usually required to experience a large scale of bending, twisting, stretching, and so on. The main challenge facing thermal management for stretchable electronics is how to maintain stable thermal conductance under large deformation. Here, we examine the development of materials and structures available in this field. We also propose a comparative analysis of the existing challenges and provide possible solutions for the thermal management of stretchable electronics in the future.
format	article
author	Bin Sun Xingyi Huang
author_facet	Bin Sun Xingyi Huang
author_sort	Bin Sun
title	Seeking advanced thermal management for stretchable electronics
title_short	Seeking advanced thermal management for stretchable electronics
title_full	Seeking advanced thermal management for stretchable electronics
title_fullStr	Seeking advanced thermal management for stretchable electronics
title_full_unstemmed	Seeking advanced thermal management for stretchable electronics
title_sort	seeking advanced thermal management for stretchable electronics
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/64c7505c9d9243fc8da048c24c312a3e
work_keys_str_mv	AT binsun seekingadvancedthermalmanagementforstretchableelectronics AT xingyihuang seekingadvancedthermalmanagementforstretchableelectronics
_version_	1718379470468939776

Seeking advanced thermal management for stretchable electronics

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