Seeking advanced thermal management for stretchable electronics
Abstract With the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For pa...
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Autores principales: | Bin Sun, Xingyi Huang |
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Formato: | article |
Lenguaje: | EN |
Publicado: |
Nature Portfolio
2021
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Materias: | |
Acceso en línea: | https://doaj.org/article/64c7505c9d9243fc8da048c24c312a3e |
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