Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs
Abstract In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step cove...
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Autores principales: | Yen-Wei Yeh, Su-Hui Lin, Tsung-Chi Hsu, Shouqiang Lai, Po-Tsung Lee, Shui-Yang Lien, Dong-Sing Wuu, Guisen Li, Zhong Chen, Tingzhu Wu, Hao-Chung Kuo |
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Formato: | article |
Lenguaje: | EN |
Publicado: |
SpringerOpen
2021
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Materias: | |
Acceso en línea: | https://doaj.org/article/66fda989a7bd4adcb7b64c7c58c6cab2 |
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