Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs

Abstract In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step cove...

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Détails bibliographiques
Auteurs principaux: Yen-Wei Yeh, Su-Hui Lin, Tsung-Chi Hsu, Shouqiang Lai, Po-Tsung Lee, Shui-Yang Lien, Dong-Sing Wuu, Guisen Li, Zhong Chen, Tingzhu Wu, Hao-Chung Kuo
Format: article
Langue:EN
Publié: SpringerOpen 2021
Sujets:
ALD
Accès en ligne:https://doaj.org/article/66fda989a7bd4adcb7b64c7c58c6cab2
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