Thermal transport across grain boundaries in polycrystalline silicene: A multiscale modeling
Abstract During the fabrication process of large scale silicene, through common chemical vapor deposition (CVD) technique, polycrystalline films are quite likely to be produced, and the existence of Kapitza thermal resistance along grain boundaries could result in substantial changes of their therma...
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| Auteurs principaux: | , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
Nature Portfolio
2019
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| Accès en ligne: | https://doaj.org/article/6a2892d1eb4f4bdf99e4159f3decc204 |
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