Thermal transport across grain boundaries in polycrystalline silicene: A multiscale modeling

Abstract During the fabrication process of large scale silicene, through common chemical vapor deposition (CVD) technique, polycrystalline films are quite likely to be produced, and the existence of Kapitza thermal resistance along grain boundaries could result in substantial changes of their therma...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Maryam Khalkhali, Ali Rajabpour, Farhad Khoeini
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2019
Materias:
R
Q
Acceso en línea:https://doaj.org/article/6a2892d1eb4f4bdf99e4159f3decc204
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!