UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, w...

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Autores principales: Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
Materias:
hyperspectral imaging
pushbroom
UV spectroscopy
principal component analysis
partial least squares regression
direct bonded copper
Chemical technology
TP1-1185
Acceso en línea:https://doaj.org/article/6a85092827184b35ae9c7c442f628be9
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https://doaj.org/article/6a85092827184b35ae9c7c442f628be9

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