UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, w...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	hyperspectral imaging pushbroom UV spectroscopy principal component analysis partial least squares regression direct bonded copper Chemical technology TP1-1185
Acceso en línea:	https://doaj.org/article/6a85092827184b35ae9c7c442f628be9
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:6a85092827184b35ae9c7c442f628be9
record_format	dspace
spelling	oai:doaj.org-article:6a85092827184b35ae9c7c442f628be92021-11-11T19:16:44ZUV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper10.3390/s212173321424-8220https://doaj.org/article/6a85092827184b35ae9c7c442f628be92021-11-01T00:00:00Zhttps://www.mdpi.com/1424-8220/21/21/7332https://doaj.org/toc/1424-8220Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, was utilized to compare the quality of the hyperspectral imaging results. For the laterally resolved measurements of the copper surfaces an UV hyperspectral imaging setup based on a pushbroom imager was used. Six different types of direct bonded copper were studied. Each type had a different oxide layer thickness and was analyzed by depth profiling using X-ray photoelectron spectroscopy. In total, 28 samples were measured to develop multivariate models to characterize and predict the oxide layer thicknesses. The principal component analysis models (PCA) enabled a general differentiation between the sample types on the first two PCs with 100.0% and 96% explained variance for UV spectroscopy and hyperspectral imaging, respectively. Partial least squares regression (PLS-R) models showed reliable performance with <i>R</i><sup>2</sup><sub>c</sub> = 0.94 and 0.94 and RMSEC = 1.64 nm and 1.76 nm, respectively. The developed in-line prototype system combined with multivariate data modeling shows high potential for further development of this technique towards real large-scale processes.Mohammad Al KtashMona StefanakisTim EnglertMaryam S. L. DrechselJan StiedlSimon GreenTimo JacobBarbara BoldriniEdwin OstertagKarsten RebnerMarc BrechtMDPI AGarticlehyperspectral imagingpushbroomUV spectroscopyprincipal component analysispartial least squares regressiondirect bonded copperChemical technologyTP1-1185ENSensors, Vol 21, Iss 7332, p 7332 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	hyperspectral imaging pushbroom UV spectroscopy principal component analysis partial least squares regression direct bonded copper Chemical technology TP1-1185
spellingShingle	hyperspectral imaging pushbroom UV spectroscopy principal component analysis partial least squares regression direct bonded copper Chemical technology TP1-1185 Mohammad Al Ktash Mona Stefanakis Tim Englert Maryam S. L. Drechsel Jan Stiedl Simon Green Timo Jacob Barbara Boldrini Edwin Ostertag Karsten Rebner Marc Brecht UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
description	Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, was utilized to compare the quality of the hyperspectral imaging results. For the laterally resolved measurements of the copper surfaces an UV hyperspectral imaging setup based on a pushbroom imager was used. Six different types of direct bonded copper were studied. Each type had a different oxide layer thickness and was analyzed by depth profiling using X-ray photoelectron spectroscopy. In total, 28 samples were measured to develop multivariate models to characterize and predict the oxide layer thicknesses. The principal component analysis models (PCA) enabled a general differentiation between the sample types on the first two PCs with 100.0% and 96% explained variance for UV spectroscopy and hyperspectral imaging, respectively. Partial least squares regression (PLS-R) models showed reliable performance with <i>R</i><sup>2</sup><sub>c</sub> = 0.94 and 0.94 and RMSEC = 1.64 nm and 1.76 nm, respectively. The developed in-line prototype system combined with multivariate data modeling shows high potential for further development of this technique towards real large-scale processes.
format	article
author	Mohammad Al Ktash Mona Stefanakis Tim Englert Maryam S. L. Drechsel Jan Stiedl Simon Green Timo Jacob Barbara Boldrini Edwin Ostertag Karsten Rebner Marc Brecht
author_facet	Mohammad Al Ktash Mona Stefanakis Tim Englert Maryam S. L. Drechsel Jan Stiedl Simon Green Timo Jacob Barbara Boldrini Edwin Ostertag Karsten Rebner Marc Brecht
author_sort	Mohammad Al Ktash
title	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
title_short	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
title_full	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
title_fullStr	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
title_full_unstemmed	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
title_sort	uv hyperspectral imaging as process analytical tool for the characterization of oxide layers and copper states on direct bonded copper
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/6a85092827184b35ae9c7c442f628be9
work_keys_str_mv	AT mohammadalktash uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT monastefanakis uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT timenglert uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT maryamsldrechsel uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT janstiedl uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT simongreen uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT timojacob uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT barbaraboldrini uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT edwinostertag uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT karstenrebner uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper AT marcbrecht uvhyperspectralimagingasprocessanalyticaltoolforthecharacterizationofoxidelayersandcopperstatesondirectbondedcopper
_version_	1718431588506664960

UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Ejemplares similares